We require the following documentation for layout design:
Our technical capabilities include
Material thickness | 0,55 mm to 3,2 mm |
Cu layers | 18, 35, 70, 105 and 210 µm |
Maximum dimensions | 500 mm x 600 mm |
Track width and insulation | 120 µm |
Minimum aperture diameter | 0,2 mm |
Surface treatment | HAL lead-free (LF) OSP (organic surface protection) Au (electroless nickel or galvanic gold ) Ag (electroless silver) Sn (electroless tin) Graphite (carbon paste) |
Solder mask | Green, black, white, blue or red |
Service printing | White, yellow or black |
Processing | Cutting, scribing, milling |
Data formats | Gerber 274X CAM 350 Version 6 and later EAGLE 3.55 and later |
Drill formats | Sieb & Mayer Excellon |